The only difference between my method and MRA's is that he instructs people to cut "pad101" away from the trace. The problem is that this is not that easy for most people. After you do it his way the pad is very weak. Many people broke the pad off while cutting it from the trace and others damaged it after when they heated it up to solder. So I came up with a 3 cut & 2 jump method that I think is much safer for the average user. Also he has the Ground point going to a tiny pad when most of the circuit board is Ground.
Also i have included some very high quality pictures that show every step in great detail.
See all the pictures in DOUBLE the resolution at this LINK
Instructions (also by MRA i changed a few words)
-Switch in closed postion (on) (position 1 on MRA's diagram)
-start dosflash --> spi should get discovered with status 0x72
-Flip switch to open position (off) (position 2 on MRA's diagram)
-If you have a Winbond SPI Flash inside (i know, you canīt be sure about this from the outside) you will probably get status 0x72 but instead of recognizing the Winbond flash it will be recognized as unknown flash chip (manufacturer and device ID 0xFF). If that is the case you canīt use Dosflash anymore, you have to use JF!
-put the switch in position 1 (ON)
-in the MTKFlash Tab click "intro"
-it shoudl get "recognized" as unknown flash chip with status 0x72 like it was in Dosflash
-put switch in position 2 (OFF)
-click onto "intro" again
-now JF should recognize the Winbond SPI with status 0x72 and you can dump the whole drive
IMPORTANT: Donīt power the drive down between the 2 intros!
Edited by syntaxerror329, 05 December 2009 - 08:29 AM.