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hi in the process of splitting my tsop ( a19 to gnd -OR- a19 to vcc3.3v)
i noticed the mcpx chip was blazing hot ( cant hold your finger on it for 10 sec ?)
i havent seen any tuts on how to install a heat sink
it looks like i could just use a small fan and heat sink combo and some thermal compound ?
i guess my question is can i take and " paralell " the power off the littel fan next to the cpu ? ( this is on a 1.0 and the fan ill be using will be left over parts from another xbox )
and .......
is hot melt glue exceptable to hold it all in place ( with thermal comp on the top of the chip ?
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Most modchips don't sit over the MCPX chip. If yours does, then you will need to reconfigure or somthing...
QUOTE
is hot melt glue exceptable to hold it all in place
If your heatsink dosn't come with a self adhesive already on it, you can use thermal epoxy. Do not use hot glue! It will insulate the chip making the heat problem worse! And then it will probably fall right off the chip.
Group: Members
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From: Tucson, Arizona USA
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Also... If you are looking for a local source, most computer stores like compusa or independants will sell "chip Cooler" kits for motherboards. they come with everything you need.
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ok
i went ahead and tried it ( the heat sink thing )
i had one left over from another box ( a 1.0 ) (the one with the fan on it)
here is what i did.
1) popped off all the heat sinks inside the box ( cpu,invidia gpu? ) 2) cleaned off m.s bubble gum stuff ( using goof off ) 3) cleaned off goof off stuff ( isoprop alchohol ) and alot of care ( i tried this out on the bad board to see chemical compatibility ) 4) painted top(s) of chips with a good name brand silver thermal compound ( including the mcpx ) 5) carefully " seated " heat sinks over proccessors then gently removed them ( again ) to verify even consistant contact over the top(s) and bottom(s) of the chips and heat sink 6) re installed sinks over the cpu/ gpu ( after applying a very small amount of compound ( again ))
7) placed heat sink/fan combo over the mcpx ( slightly coc-eyed as not to hit anything or connect with anything ) 8) then used small amounts of hot melt glue and blobbed the corners of the heat sink (one corner over the ram , one corner over the tsop , one to a epoxy coated path of traces with no exposed points ) 9) connected leads from the new mcpx fan " paralelle " ( red to red , black to black) to the gpu fan
slapped it back together and everything works
issues: hot melt glue isnt as " solid as a "clip" and expansion and contraction may create "gaps" in the compound defeating its heat conductive properties? , ram doesnt get hot enough to melt glue ?
what do you think? i can get pics? please excuse my english im from new jersey,usa
thanx for any and all reply
all this did lower the cpu temp 7 degrees ( or so ) (evox dash) question: where does the "mother board temp" get " read " from?
This post has been edited by raggedraider: Jan 7 2005, 11:11 PM
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@raggedraider: that should work.
A tip for the next time you're applying thermal compound: Place a _small_ lump of compound in the middle of the chip, do not spread it around. Firmly press the heat sink onto the chip. Secure heat sink.
With the thermal compounds less is more. Their purpose is to fill in the small surface irregularities in the mating surfaces of the chip and heat sink. You should really have only a thin film with no air bubbles. The easiest way to do that is the method outlined above. -nB
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Hrm, I'll have to order one some time. I haven't had my box open in a while I was under the impression they were closer. Thanks for the pics, turns out the memory isn't as good as I thought