QUOTE(yellowblanket @ Mar 30 2006, 12:26 AM)
most of the replies were against MS story about the foil,
I'm sorry but true or not, it's just common sense that when you applying thermal, u'd cut the wrapping foil, not placing the whole pack on there and squish it down with the chipset on top.
Just because more people think one way doesn't mean they're right or properly informed.
QUOTE(Mick Garvey @ Mar 30 2006, 02:21 AM)
and it goes on, someone even had a link to the factory specs of the thermal tape used and it said it has a thin foil layer.
That's correct, The foil is meant to be there, it' can't hold a candle to good thermal past (in fact it's quite crappy by comparison) but if you leave the "paste" that's behind the foil on, and just remove the foil it will actually be WORSE then if you left the foil there because that paste is meant to work with the foil.
I'd agree that the factory cooling system is adequate, I have a launch console and play 3-4 hours every night and often do marathon sessions on weekends, I've never experienced problems with over heating. If you're having problems I'd recommend contacting MS and getting your console replaced.
If I did decide to do anything cooling wise replacing the thermal compound is probably the only thing I'd do, I'd maybe consider adding heatsyncs to a few other chips like the ram, video encoder, and north bridge, etc. Pretty much what I did with my Xbox1. IMO replacing the fans is a bit of a waste because you flat out can't find fans that would cool better with equal or lower noise levels.