question for the xecuter boys about the new x2.6 chip, which i understand is more ver. 1.6 friendly:
Will we have to go through the same proceducer when installing the 2.6? Meaning, rebuild the LPC, wires all over the place etc? Will it be a bit easier to install/flash? im thinking somewhere along the lines of a 1.5 install with a samsung drive
Furthermore, im confused about something else. When rebuilding the LPC the LAD0 (green) arrows point at 2 differen points: One under the board (where I
hooked up my point on the LPC to) and the one on the TOP which to me seems to correspond with the spot where you would hook up the gray wire for the d0 (next to the xylops chip)
So my question is this, if you're trying to install the gray d0 wire to the top of the board near the Xylops, and you bugger that via up, can you install it underneath the board where the other green arrow points?
Lastly, if i say i lifed my d0 point, i noticed there is a trace from it to another VIA a tiny bit close to the Xylops chip, would those 2 vias have to be repaired under my above stated circumstances? I tried soldering to both(one specified in the tutorialls, and the one closer to the chip), and im still fragging...
and sorry for the novel... This post has been edited by shiz: Aug 13 2004, 05:56 PM