QUOTE(blame canada @ Sep 6 2006, 09:27 PM)
Wow, I definately beg to differ. The bottom d0 is about 2x bigger than the top, and the top sometimes has that laquer (sp?) crap on it that you sometimes hace to scrape off. I'd rather run 3" more wire and have a much easier soldering job, then save 3" and try and get the top. Just my opinion, so to each his own
And yea, if the board frags without the chip, then you probably bridged/burned a trace on the LPC area.
I agree.. DO NOT SOLDER D0 TO THE TOP OF THE MOTHERBOARD.
The chances of getting it soldered.. and i mean soldered well.. are very slim.
Solder it to the bottomside instead.
If you damage that topside trace your motherboard will not boot.