Jan 17 2006, 10:27 PM
hi all. i have a v1.0 xbox with a solderless x2.3b lite chip in it. the d0 just wont stay in place. its so damn touchy. lol. is there an easy way to solder it down? maybe solder a small wire to the d0 and the other end to the spot on the chip where the d0 is? or maybe put some solder on the d0 itself to make it larger? any other ideas would be great. hoping not to buy anything. thanks.
Jan 17 2006, 11:47 PM
That's the problem with the solderless chips. I had the exact same problem. 1.0 xbox w/ 2.3 chip. I gave up & got a 2.6 & soldered it in. Use the wire header.
But...you could solder a wire onto the POGO pin on the chip...run it around underneath the board & solder it to the D0 point on the underside of the mobo.
But, if you're going to that trouble, I'd just get a new chip...