Ok just a quick question, i have a version 1.0 xbox that has the lpc holes filled. Now what i believe is that my solderless chip is not making a good connection with it so i plan to remove the solder, and just try the solderless chip that way, and if that doens't work install the pin header.

So should i desolder all the filled holes, or like it says in the xenium guide, leave the 4 up top filled? Do they need to be filled for the pin header install?

well you can leave any holes filled with solder that you don't need for a pin to go into.

btw, if you are going to desolder the lpc holes u might as well solder in the pin header while your at it. plus you will get alot better connection than with the solderless adapter.

Now im really have never soldered before, with a small soldering iron, or on an xbox.

Just a few more questions, when i go to desolder where do i place the tip? In the solder or on the side of the hole?

Also if say i get some solder on the board by the lpc hole that will ruin the board right? And when i go to solder the pin headers in to i place the tip of the iron on the pins and then touch the solder to the pin to fill the hole?

Also if theres any other soldering/desoldering tips anyone can give me it would be greatly appreciatied.

put directly on top top of the lpc filled hole and predown on the braid and you will see the braid take the solder from the hole simple process I have done this many times and you really can't hurt anything by doing it just donot remove solder from any other part on the xbox

I desolder in a similar fashion as the above poster. I add a little flux to the LPC, then apply the desolder braid then I lay my 40w iron on top of that. You will see the solder start to flow into the braid, it usually travels up about 3/4s of an inch before it stops. This will happen in seconds. I would say practice on the four LPC holes you dont need, to get the timing right. If you pull the braid off to soon it will leave some solder which is harder to remove.